The diffusion bonding approach. In-between the two OO3 and this interface layer, it can be attainable to observe a thin layer ( 1 ) composed of alternated different grey layer, it truly is feasible to observe a thin layer (1 ) composed of alternated distinctive grey columnar Mouse References smaller grains. Even so, it it was not probable to execute EDS analyses owingits columnar modest grains. Having said that, was not possible to execute EDS analyses owing to to lowered thickness. its decreased thickness.(a)(b)(c)Figure 6. SEM photos from the joints with thin film interlayer processed at at (a) C for 60 (b) (b) C for 10 min, and Figure six. SEM pictures with the joints with Ti Ti thin film interlayer processed(a) 950 950for 60 min,min,1000 1000 for 10 min, and (c) C for 60 min. min. (c) 1000 1000 forIncreasing the bonding time at 1000 C to 60 min promotes the modify in the thickness Rising the bonding time at 1000 to 60 min promotes the adjust within the thickof the layers that compose the interface. This interface is usually observed in Figure 6c. The ness of your layers that compose the interface. This interface could be observed in Figure 6c. enhance in the bonding time outcomes in the reduce within the -Ti phase plus the growth from the The boost within the bonding time final results in the reduce inside the -Ti phase and the 3-Chloro-5-hydroxybenzoic acid Technical Information development Ti3 Al layer with TiAl particles close to Al2 O3 (Z4 in Figure 6c). in the Ti3Al layer with TiAl particles close to Al2O3 (Z4 in Figure 6c). The confirmation from the phases in the interfaces was conducted by EBSD, which The confirmation of the phases in the interfaces was conducted by EBSD, which alallows Kikuchi patterns of tiny zones to become obtained resulting from the lowered interaction volume. lows Kikuchi patterns of tiny zones to be obtained on account of the decreased interaction volume. Figure 7 shows EBSD Kikuchi patterns of your joint processed at 1000 C for 60 min. This Figure 7 shows EBSD Kikuchi patterns of the joint processed at 1000 for 60 min. This technique was of paramount value to confirm the presence in the -TiAl intermetallic phase close for the Al2 O3 base material.approach was of paramount importance to confirm the presence of your -TiAl intermetallic phase close for the Al2O3 base material.Metals 2021, 11,Table 1. Chemical composition obtained by EDS from the zones in Figure six.9 ofElement (at. ) Table 1. Chemical composition obtained by EDS of your zonesV Figure 6. in Ti Al 1 88.5 ten.3 1.two Element (at. ) Zone Circumstances 2 88.three ten.3 1.five Ti Al V 3 76.five 22.five 1.0 950 /60 min 1 88.5 ten.3 1.two 80.3 6.7 ten.3 13.0 24 88.three 1.5 35 76.5 1.0 950 C/60 min 65.1 33.722.five 1.two 4 80.three 6.7 13.0 1 86.eight 11.six 1.six 5 65.1 33.7 1.2 2 73.3 19.7 7.0 1 86.eight 11.six 1.six 1000 /10 min 86.0 11.919.7 2.1 23 73.3 7.0 C/10 min 1000 34 86.0 2.1 75.0 25.011.9 4 75.0 25.0 1 88.3 11.7 12 88.three 77.1 six.9 11.7 16.0 2 77.1 six.9 16.0 1000 /60 min C/60 min 1000 74.five 25.525.five 33 74.5 44 57.6 57.6 42.442.4 Situations Zone–not detected. –not detected.Probable Phases -TiPossible Phases -Ti2-Ti3Al -Ti -Ti -Ti -Ti3 Al 2-Ti3Al2 -TiAl -Ti -Ti two -Ti3 Al -TiAl -Ti -Ti -Ti -Ti -Ti 2-Ti3Al two -Ti3 Al -Ti -Ti -Ti -Ti 2-Ti3Al 2 -Ti3 Al 2 -Ti3 -TiAl 2-Ti3AlAl -TiAl(b)two(a)(c)Figure 7. (a) SEM 7. (a) SEM images from the interface made with Ti thin film processed at 1000for 60 min, (b)(b) EBSD Kikuchi Figure pictures of the interface created with Ti thin film processed at 1000 C for 60 min, EBSD Kikuchi patterns of your grain marked asof the(a) indexed asas 1 in (a)and (c) EBSD Kikuchi patterns of your g.